Samsung is increasing its investment in domestic and overseas production facilities to enhance its advanced semiconductor packaging capabilities, according to Chinese media outlet Jiwei. As in-house packaging processes for next-generation high-bandwidth memory (HBM) products, such as HBM4, become increasingly critical, Samsung aims to improve its packaging technology to remain competitive and close the gap with SK Hynix, the report said. Industry sources revealed that Samsung signed a 20 billion KRW ($15.2 million) equipment procurement contract in the third quarter to expand its production facilities at its Suzhou plant in China. The Suzhou plant is currently Samsung’s only overseas testing and packaging production base. [Jiwei, in Chinese]